Pouya Asrar - Advancing Thermal Solutions for Electronics

With over 15 years of experience in microelectronics packaging and thermal engineering, Pouya Asrar has developed a career spanning academic research, consumer electronics, and semiconductor packaging. As a senior manager at Samsung, Pouya Asrar helped customers navigate advanced packaging solutions and coordinated with internal sales and engineering teams.

Pouya Asrar supported technical assessments, managed ongoing engagements, and helped ensure that proposed solutions meet customer expectations. His experience connects engineering considerations with the practical demands of product development and customer relationships.

Additionally, Pouya Asrar served as an applied thermal scientist on Amazon's Alexa team. He owned thermal and mechanical analysis for smart home devices, using simulation and physical testing to evaluate performance at the component, chip, and system levels. At Tesla, he investigated the thermal behavior of infotainment electronics through computational simulations and experimental validation.

Research has remained an important part of his professional foundation. At the Georgia Institute of Technology, where Pouya Asrar completed his PhD in mechanical engineering, He studied microfluidic cooling systems designed to improve heat transfer. His work examined two-phase refrigerant flow through microgaps with integrated pin fins, contributing to research on cooling increasingly complex electronic systems.

His academic achievements include a Best Presentation Award at an IMAPS conference and travel grants that supported his participation in IEEE technical conferences. Pouya Asrar has also served as a technical reviewer for an IEEE journal.

Combining analytical problem-solving with hands-on testing and cross-functional leadership, Pouya Asrar brings a research-driven perspective to the evolving challenges of semiconductor packaging and electronic thermal management.